![]() This will assist the surface in achieving a strong bond when applied. A bonding agent, such as titanium nitride, is applied to the surface of the material. Now that the substrate is prepared, the coating process can begin. This strips away these impurities instead of bonding to the surface. This is achieved by subjecting the substrate to ions of another material, such as argon gas. The cleaning process is typically known as sputtering. This aids the process, by making the next steps easier to perform. The chamber is introduced to a low vacuum. The cleaning is done in a closed environment where the plating will also be applied. Foreign materials must be removed at this stage to prevent any spoiling of the finish. ![]() To begin, the material that will be plated, otherwise known as the substrate, must be cleaned. Occasionally, this process may be referred to as ‘IP plating.’ However, this the same as stating ‘ion plating plating!’ Just know that all of these terms refer to ion plating. Besides that name, the process is called ion assisted deposition (IAD) or ion vapor deposition (IVD). The ion plating process may also be known as physical vapor deposition (PVD), its technical term that applies to several methods.
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